Decapping an IC
I tried disolving the epoxy on some PAL ICs to view under a microscope with the goal of reading the fuse map. I wasn't so successful. :(
http://www.stockly.com/images1/01280...1_IMGP0669.jpg We've got a hot plate, IR temperature probe, and a chunk of steel. http://www.stockly.com/images1/01280...2_IMGP0671.jpg After about an hour, nothing. The hole on the chip to the right was milled in it with a dremel. It didn't help. The plate got hot enough at one point to light the nitric acid on fire. Not cool. Its a good thing I did the project in a negative pressure fume hood. :) After doing this for an hour, I gave up. The acid is just too dilute. So I took it over to the surface polishing tools used for steel and took the plastic down to the silicon layer. http://www.stockly.com/images1/01280...3_IMGP0676.jpg There is a bond wire in the plastic. http://www.stockly.com/images1/01280...4_IMGP0673.jpg I think a lot of the black stuff is plastic that was left behind. I ground too heavily on one side and now it looks like a mirror, no traces at all. :( http://www.stockly.com/images1/01280...5_IMGP0675.jpg The further you go down, the more black IC epoxy junk we see. http://www.stockly.com/images1/01280...6_IMGP0677.jpg It was fun while it lasted. ;) |
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